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0850-0-15-20-63-14-11-0

Part number 0850-0-15-20-63-14-11-0
Product classification Contacts, Spring Loaded (Pogo Pins), and Pressure
Manufacturer Mill-Max
Description LOW FORCE THROUGH-HOLE SOLDER MO
Encapsulation
Packing Bulk
Quantity 2
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$1.7955

$1.7955

10

$1.5645

$15.6450

100

$1.3965

$139.6500

1000

$0.9975

$997.5000

5000

$0.8820

$4,410.0000

10000

$0.8610

$8,610.0000

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Product parameters
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TYPEDESCRIPTION
MfrMill-Max
Series850
PackageBulk
Product StatusACTIVE
Contact FinishGold
Current Rating (Amps)6.4A
Mounting TypeThrough Hole
Operating Temperature-55°C ~ 125°C
Contact TypeSleeve & Plunger (Pogo Pins)
Contact Finish Thickness20.0µin (0.51µm)
Contact MaterialBrass Alloy
Mating Cycles1000000
Maximum Working Height0.220" (5.58mm)
Recommended Working Height0.175" (4.45mm)
Minimum Working Height0.130" (3.29mm)
Pad Layout DimensionCircular - 0.153" (3.89mm) (TH)
Plunger Size0.050" (1.27mm) Dia
Operating Force - Initial15gf
Operating Force - Mid Compression55gf

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
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MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
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MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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