技术参数

• Part Status Active
• Cable Group -
• Center Conductor Diameter -
• Wire Gauge -
• Contact Termination Solder
• Pin or Socket Socket
• Type MPRF
• Mounting Type Through Hole, Right Angle
• Impedance 50 Ohms
• Contact Material Beryllium Copper
• Contact Finish Gold
• Contact Finish Thickness 8.0µin (0.20µm)
• Features -
• Board Thickness -
• Moisture Sensitivity Level (MSL) Not Applicable
• ECCN EAR99
• HTSUS 8536.90.4000