技术参数

• Part Status Active
• Connector Type High Density Array, Male
• Number of Positions 60
• Pitch 0.031" (0.80mm)
• Number of Rows 2
• Mounting Type Surface Mount
• Features Board Guide, Pick and Place
• Contact Finish Gold
• Contact Finish Thickness 30.0µin (0.76µm)
• Mated Stacking Heights -
• Height Above Board 0.154" (3.90mm)
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• ECCN EAR99
• HTSUS 8536.69.4040